Huawei’s recent release of the Ascend 910B AI chips has raised eyebrows after it was revealed that these chips contain core circuitry developed by Taiwan Semiconductor Manufacturing Co. (TSMC). This discovery is surprising given the extensive U.S. sanctions imposed on Huawei, intended to prevent the Chinese tech giant from accessing American and allied technology. Despite these sanctions, it appears that TSMC technology has found its way into Huawei’s latest AI chips, sparking questions about enforcement gaps.
The inclusion of TSMC technology in Huawei’s chips highlights the complexities of global tech supply chains, where even stringent regulations sometimes fail to entirely block the flow of technology. TSMC, as one of the world’s leading semiconductor companies, plays a critical role in global chip production, and its technology is integral to advanced AI and telecommunications systems. The presence of TSMC’s designs in Huawei’s chips could potentially lead to tighter export controls or new regulations targeting indirect technology transfers.
This development has further strained U.S.-China tech relations, with the U.S. likely to scrutinize its export control policies more closely. The revelation not only underscores the challenges in enforcing technology restrictions but also raises concerns over the possible unintended diffusion of advanced technology to entities under sanction.
